) is used to strike the initial plasma ignition. Because it acts as a simple asphyxiant, your workspace must maintain an oxygen content of at least 18% by volume. Electrical and Shock Protection
The is an industry-standard, self-contained Remote Plasma Source (RPS) designed primarily for chamber cleaning applications in semiconductor manufacturing . Utilizing high-efficiency toroidal plasma technology, it efficiently dissociates gases like nitrogen trifluoride ( NF3NF sub 3
The Astron 2L (and its sibling, the Astroni) uses a silent corona discharge to convert oxygen into high-concentration ozone. Up to 2 liters per minute (Lpm). mks astron 2l manual
The manual specifies: Pressure (Torr) = 10^(Vout - 8) . For example, 6 V output = 10⁻² Torr; 4 V output = 10⁻⁴ Torr.
: Operates typically between 1 to 10 Torr. ) is used to strike the initial plasma ignition
during operation and 0.5 gpm during idle; water temperature must be below 30°C. Operating Pressure : Designed for an operating regime between 1–10 torr (post-ignition). Gas Compatibility : Typically uses Argon (grade 4.4 or better). : Optimized for 100% cap N cap F sub 3 dissociation but can support other gas alternatives. Operational Features High Efficiency
(nitrogen trifluoride) dissociation to generate atomic fluorine for chamber cleaning. DatasheetArchive For example, 6 V output = 10⁻² Torr;
The is a high-performance Remote Plasma Source (RPS) and integrated switching power supply system widely used in semiconductor manufacturing and laboratory environments . Primarily acting as a reactive gas generator, this system is engineered for chemical vapor deposition (CVD) chamber cleaning and atomic fluorine generation applications.
Never exhaust ozone directly into the workspace; use an ozone destruct unit.